Posted by rajesh |
Sunday, October 12, 2003
Thursday, October 09, 2003
United States Patent: 6,574,763 Method and apparatus for semiconductor integrated circuit testing and burn-in - bY IBM people
Posted by rajesh |
United States Patent: 6,274,395Method and apparatus for maintaining test data during fabrication of a semiconductor wafer
Posted by rajesh |
United States Patent: 5,895,967: "Ball grid array package having a deformable metal layer and method "
Posted by rajesh |